Produttore elettronici | Il numero della parte | Scheda tecnica | Spiegazioni elettronici |
Xilinx, Inc |
CS280
|
47Kb / 1P |
Ball Chip Scale Package
|
Fujitsu Component Limit... |
BGA-320P-M06
|
34Kb / 1P |
PLASTIC BALL GRID ARRAY PACKAGE 320 PIN PLASTIC
|
Abracon Corporation |
ASCSM
|
1Mb / 3P |
Ball Grid Array Packaging
04.24.14 |
STATS ChipPAC, Ltd. |
FBGA
|
559Kb / 2P |
Fine Pitch Ball Grid Array
|
Yamaichi Electronics Co... |
IC280-169-127
|
263Kb / 5P |
Ball Grid Array (FBGA / CSP / LGA)
|
NP276-11904
|
738Kb / 11P |
Ball Grid Array (BGA, 1.27mm Pitch)
|
NP396-500
|
120Kb / 1P |
Shrink Ball Grid Array (1.27mm Pitch)
|
KOA Speer Electronics, ... |
BR
|
370Kb / 2P |
ball grid array (bga) resistor networks
|
Yamaichi Electronics Co... |
IC264-22501-1
|
200Kb / 1P |
Ball Grid Array (BGA, 1.50mm Pitch)
|
ON Semiconductor |
CM1205
|
115Kb / 5P |
8-Channel ESD Protection Array in Chip Scale Package
January, 2011 ??Rev. 4 |