# HX316C9SRK2/16

16GB (8GB 1G x 64-Bit x 2 pcs.)
DDR3-1600 CL9 240-Pin DIMM Kit

## DESCRIPTION

· A kit of two 1G x 64-bit (8GB) DDR3-1600 CL9 SDRAM memory modules.
· Supports Intel® XMP (Extreme Memory Profiles).
· Total kit capacity is 16GB.
· Each module has been tested to run at DDR3-1600 with a low latency timing of 9-9-9 at 1.5V.
· Uses gold contact fingers.

## SPECIFICATIONS

Electrical Characteristics
· JEDEC standard 1.5V (1.425V ~ 7.575V) Power Supply
· VDDQ = 1.5V (7.425V ~ 7.575V)
· 800MHz fCK for 1600Mb/sec/pin
· 8 independent internal banks
· Programmable CAS latency: 11, 10, 9, 9, 8, 7, 6

Timing & Calibration
· Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
· 8-bit pre-fetch
· Burst Length: 8 or 4
· Internal self calibration through ZQ pin (RZQ: 240 ohm ± 1%)
· On Die Termination using ODT pin
· Average Refresh Period: 7.8us (lower than 85°C), 3.9us (85°C < TCASE < 95°Cº)
· Asynchronous Reset

Physical Characteristics
· Height: 1.311” (33.30mm), with heatsink, double-sided component
· Module Dimensions: 7.9 mm x 133.35 mm x 33.3 mm

## XMP PARAMETERS

· JEDEC: DDR3-1600 CL11-11-11 @1.5V
· XMP Profile #1: DDR3-1600 CL9-9-9 @1.5V

## OPERATING CONDITIONS

· UL Rating: 94 V - 0
· Operating Temperature: 0°C to +85°C
· Storage Temperature: -55°C to +100°C