# HX316C10FBK2/8

8GB (4GB 512M x 64-Bit x 2 pcs.)
DDR3-1600 CL10 240-Pin DIMM Kit

## DESCRIPTION

· Kit of two 512M x 64-bit (4GB) DDR3 SDRAM modules.
· Total kit capacity: 8GB.
· Tested to run at DDR3-1600 with a timing of 10-10-10 at 1.5V.

## SPECIFICATIONS

· Row Cycle Time (tRCmin): 48.125ns (min.)
· Refresh to Active/Refresh: 860ns (min.)
· Row Active Time (tRASmin): 37.5ns (min.)
· Operating Temperature: 0°C to 85°C
· Storage Temperature: -55°C to +100°C

## FEATURES

· JEDEC standard 1.5V (1.425V ~1.575V) Power Supply
· VDDQ = 1.5V (1.425V ~ 1.575V)
· fCK: 800MHz for 1600Mb/sec/pin
· 8 independent internal bank
· Programmable CAS Latency: 11, 10, 9, 8, 7, 6
· Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
· 8-bit pre-fetch
· Burst Length: 8 (Interleave) or 4
· Bi-directional Differential Data Strobe
· Internal self calibration via ZQ pin (RZQ : 240 ohm ± 1%)
· On Die Termination using ODT pin
· Average Refresh Period: 7.8us (TCASE < 85°C), 3.9us (85°C < TCASE < 95°C)
· Asynchronous Reset
· Height: 1.291” (32.80mm) with heatsink

## DIMENSIONS

· Module Height (with heatsink): 1.291” (32.80mm)
· Module Width: 133.35 mm
· Module Length: 7.08 mm

## PNP JEDEC TIMING PARAMETERS:

· DDR3-1600 CL10-10-10 @1.5V
· DDR3-1333 CL9-9-9 @1.5V
· DDR3-1066 CL7-7-7 @1.5V