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# HX316C10FK2/8
8GB (4GB 512M x 64-Bit x 2 pcs.)
DDR3-1600 CL10 240-Pin DIMM Kit
## DESCRIPTION
HyperX HX316C10FK2/8 is a kit of two 512M x 64-bit (4GB) DDR3-1600 CL10 SDRAM modules. Total kit capacity is 8GB.
## SPECIFICATIONS
Electrical
· JEDEC standard 1.5V (1.425V ~1.575V) Power Supply
· VDDQ = 1.5V (1.425V ~ 1.575V)
· fCK: 800MHz (1600Mb/sec/pin)
Timing
· Programmable CAS Latency: 11, 10, 10, 9, 8, 7, 6
· Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
· PnP JEDEC TIMING PARAMETERS:
- DDR3-1600 CL10-10-10 @1.5V
- DDR3-1333 CL9-9-9 @1.5V
- DDR3-1066 CL7-7-7 @1.5V
Environmental
· Operating Temperature: 0°C to 85°C
· Storage Temperature: -55°C to +100°C
## FEATURES
· 8 independent internal bank
· 8-bit pre-fetch
· Burst Length: 8 (Interleave), 4 (with tCCD = 4)
· Bi-directional Differential Data Strobe
· Internal self calibration via ZQ pin (RZQ : 240 ohm ± 1%)
· On Die Termination using ODT pin
· Average Refresh Period: 7.8us (TCASE < 85°C), 3.9us (85°C < TCASE < 95°C)
· Asynchronous Reset
## DIMENSIONS
· Height: 1.291” (32.80mm) with heatsink
· Module Dimensions: 133.35 mm x 7.08 mm x 32.8 mm
# HX316C10FK2/8
8GB (4GB 512M x 64-Bit x 2 pcs.)
DDR3-1600 CL10 240-Pin DIMM Kit
## DESCRIPTION
HyperX HX316C10FK2/8 is a kit of two 512M x 64-bit (4GB) DDR3-1600 CL10 SDRAM modules. Total kit capacity is 8GB.
## SPECIFICATIONS
Electrical
· JEDEC standard 1.5V (1.425V ~1.575V) Power Supply
· VDDQ = 1.5V (1.425V ~ 1.575V)
· fCK: 800MHz (1600Mb/sec/pin)
Timing
· Programmable CAS Latency: 11, 10, 10, 9, 8, 7, 6
· Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
· PnP JEDEC TIMING PARAMETERS:
- DDR3-1600 CL10-10-10 @1.5V
- DDR3-1333 CL9-9-9 @1.5V
- DDR3-1066 CL7-7-7 @1.5V
Environmental
· Operating Temperature: 0°C to 85°C
· Storage Temperature: -55°C to +100°C
## FEATURES
· 8 independent internal bank
· 8-bit pre-fetch
· Burst Length: 8 (Interleave), 4 (with tCCD = 4)
· Bi-directional Differential Data Strobe
· Internal self calibration via ZQ pin (RZQ : 240 ohm ± 1%)
· On Die Termination using ODT pin
· Average Refresh Period: 7.8us (TCASE < 85°C), 3.9us (85°C < TCASE < 95°C)
· Asynchronous Reset
## DIMENSIONS
· Height: 1.291” (32.80mm) with heatsink
· Module Dimensions: 133.35 mm x 7.08 mm x 32.8 mm
| Part No. | HX316C10FK2-8 |
| Manufacturer | ETC2 |
| Size | 429 Kbytes |
| Pages | 2 pages |
| Description | DDR3-1600 CL10 240-Pin DIMM Kit |
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