# HX318C9SRK2/8

8GB (4GB 512M x 64-Bit x 2 pcs.)
DDR3-1866 CL9 240-Pin DIMM Kit

DESCRIPTION

️· A kit of two 512M x 64-bit (4GB) DDR3-1866 CL9 SDRAM memory modules.
️· Supports Intel® XMP (Extreme Memory Profiles).
️· Total kit capacity is 8GB.
️· Uses gold contact fingers.
️· 240-pin DIMM.

FEATURES

️· Power Supply: JEDEC standard 1.5V (1.425V ~ 1.575V)
️· VDDQ: 1.5V (1.425V ~ 1.575V)
️· Data Strobe: Bi-directional Differential Data Strobe
️· Calibration: Internal self-calibration via ZQ pin (RZQ: 240 ohm ± 1%)
️· Termination: On Die Termination using ODT pin
️· Refresh Period: 7.8us (TCASE < 85°C), 3.9us (85°C < TCASE < 95°C)
️· Height: 1.311” (33.30mm) w/heatsink

XMP TIMING PARAMETERS

️· JEDEC: DDR3-1600 CL11-11-11 @1.5V
️· XMP Profile #1: DDR3-1866 CL9-10-11 @1.5V
️· XMP Profile #2: DDR3-1600 CL9-9-9 @1.5V

SPECIFICATIONS

️· CL(IDD): 11 cycles
️· Row Cycle Time (tRCmin): 48.125ns(min.)
️· Refresh to Active/Refresh Command Time (tRFCmin): 260ns(min.)
️· Row Active Time (tRASmin): 35ns(min.)
️· Maximum Operating Power: TBD W*
️· UL Rating: 94 V - 0
️· Operating Temperature: 0°C to +85°C
️· Storage Temperature: -55°C to +100°C

MODULE DIMENSIONS (with Heat Spreader)

️· 7.9 mm