# HX318C9T2K4/16

16GB (4GB 512M x 64-Bit x 4 pcs.)
DDR3-1866 CL9 240-Pin DIMM Kit

## Description

️· Kit of four 512M x 64-bit (4GB) DDR3-1866 CL9 SDRAM modules.
️· Supports Intel® XMP (Extreme Memory Profiles).
️· Total kit capacity: 16GB.
️· Tested to run at DDR3-1866 with latency of 9-10-11 at 1.5V.
️· Uses gold contact fingers.

## XMP Timing Parameters

️· JEDEC: DDR3-1600 CL11-11-11 @1.5V
️· XMP Profile #1: DDR3-1866 CL9-10-11 @1.5V
️· XMP Profile #2: DDR3-1600 CL9-9-9 @1.5V

## Specifications

️· Row Cycle Time (tRCmin): 48.125ns (min.)
️· Refresh to Active/Refresh: 260ns (min.)
️· Row Active Time (tRASmin): 35ns (min.)
️· Operating Temperature: 0°C to 85°C
️· Storage Temperature: -55°C to +100°C

## Features

️· JEDEC standard 1.5V Power Supply (1.425V ~ 1.575V)
️· VDDQ = 1.5V (1.425V ~ 1.575V)
️· fCK: 800MHz
️· 8 independent internal bank
️· Programmable CAS Latency: 11, 10, 9, 8, 7, 1
️· Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
️· 8-bit pre-fetch
️· Burst Length: 8 (Interleave) or 4 (with tCCD = 4)
️· Bi-directional Differential Data Strobe
️· Internal Calibration (RZQ : 240 ohm ± 1%)
️· On Die Termination
️· Average Refresh Period: 7.8us - 3.9us
️· Asynchronous Reset
️· Height: 2.118” (53.80mm) w/heatsink

## Dimensions

️· Module with Heat Spreader: 133.35 mm x 8.12 mm