2.0MM PITCH/DISCONNECTABLE INSULATION DISPLACEMENT AND Datasheet(PDF) - IM890

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2.0MM PITCH/DISCONNECTABLE INSULATION DISPLACEMENT AND Scheda tecnica, PDF

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Parola chiave cercata : '2.0MM PITCH/DISCONNECTABLE INSULATION DISPLACEMENT AND ' - Total: 12 (1/1) Pages

Produttore elettronici	Il numero della parte	Scheda tecnica	Spiegazioni elettronici
ILSI America LLC	IM890	1Mb/10P	Pb-free, RoHS and REACH compliant
	IM830	734Kb/9P	Pb-free, RoHS and REACH compliant
	IM820	794Kb/9P	Pb-free, RoHS and REACH compliant
	ZTTS-MG	56Kb/2P	2 Pad and 3 Pad Ceramic Package, 3.4 mm x 7.4 mm and 4.1 mm x 4.7 mm
	ZTTS	54Kb/2P	2 Pad and 3 Pad Ceramic Package, 3.4 mm x 7.4 mm and 4.1 mm x 4.7 mm
	HCOF	57Kb/2P	Metal Package Full Size DIP and Half DIP, TTL / HC-MOS
	ZTACV	45Kb/2P	2 Pad and 3 Pad Ceramic Package, 3.1 mm x 3.7 mm
	ZTTCV-MX	56Kb/2P	2 Pad and 3 Pad Ceramic Package, 3.1 mm x 3.7 mm
	ZTT	46Kb/2P	2 Pad and 3 Pad Ceramic Package, 5.5 mm x 10 mm
	ZTT-MG	57Kb/2P	2 Pad and 3 Pad Ceramic Package, 5.5 mm x 10 mm
	I202	48Kb/2P	Leaded Oscillator, VCXO, TTL / HC-MOS Metal Package, Full Size DIP and Half DIP
	I212	47Kb/2P	Leaded Oscillator, VCXO, TTL / HC-MOS Metal Package, Full Size DIP and Half DIP

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2.0MM PITCH/DISCONNECTABLE INSULATION DISPLACEMENT AND Scheda tecnica, PDF

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