| Produttore elettronici | Il numero della parte | Scheda tecnica | Spiegazioni elettronici |

Taiyo Yuden (U.S.A.), I...
|
FI105B245024-T |
241Kb/2P |
Multilayer Ceramic Devices (Band Pass Type) |
| FI168B2002H7-T |
247Kb/2P |
Multilayer Ceramic Devices (Band Pass Type) |
| TSB1N15H2G45NS024T |
297Kb/2P |
Multilayer Ceramic Devices (Band Pass Type) 2022.04.08 |
| TSB1N18F2G45NS001T |
292Kb/2P |
Multilayer Ceramic Devices (Band Pass Type) 2022.04.08 |
| FI212B245027-T |
238Kb/2P |
Multilayer Ceramic Devices (Band Pass Type) |
| FI168B5538FW-T |
247Kb/2P |
Multilayer Ceramic Devices (Band Pass Type) |
| FI212B245026-T |
238Kb/2P |
Multilayer Ceramic Devices (Band Pass Type) |
| TSB1N18D845MLV0D9T |
301Kb/2P |
Multilayer Ceramic Devices (Band Pass Type) 2022.04.08 |
| FI168B245001-T |
237Kb/2P |
Multilayer Ceramic Devices (Band Pass Type) |
| FI212B190223-T |
236Kb/2P |
Multilayer Ceramic Devices (Band Pass Type) |
| FI168B0845D9-T |
247Kb/2P |
Multilayer Ceramic Devices (Band Pass Type) |
| TSB1N18D2G00LV0H7T |
301Kb/2P |
Multilayer Ceramic Devices (Band Pass Type) 2022.04.08 |
| TSB1N18D5G53LV0FWT |
301Kb/2P |
Multilayer Ceramic Devices (Band Pass Type) 2022.04.08 |
| TSB1N18D5G53LV0HBT |
314Kb/2P |
Multilayer Ceramic Devices (Band Pass Type) 2021.11.26 |
| FI212B3750EQ-T |
242Kb/2P |
Multilayer Ceramic Devices (Band Pass Type)for 5G |
| TSB1N21D4G15LV0HWT |
299Kb/2P |
Multilayer Ceramic Devices (Band Pass Type)for 5G 2021.11.26 |
| TSB1N21D4G70LV0DQT |
296Kb/2P |
Multilayer Ceramic Devices (Band Pass Type)for 5G 2022.04.08 |
| TSB1N21D3G75LV0EQT |
296Kb/2P |
Multilayer Ceramic Devices (Band Pass Type)for 5G 2022.04.08 |
| FI212B4700DQ-T |
242Kb/2P |
Multilayer Ceramic Devices (Band Pass Type)for 5G |