| Produttore elettronici | Il numero della parte | Scheda tecnica | Spiegazioni elettronici |

Advanced Power Electron...
|
AP4527GN3 |
101Kb/7P |
Bottom Exposed DFN |
| AP2434GN3-HF |
94Kb/4P |
Bottom Exposed DFN |
| AP2428GN3 |
179Kb/5P |
Bottom Exposed DFN |
| AP6970GN2-HF |
107Kb/4P |
Bottom Exposed DFN, Lower Profile |
| AP2430GN3-HF |
96Kb/4P |
Bottom Exposed DFN, Low On-resistance |
| AP4527GN3 |
101Kb/7P |
Bottom Exposed DFN, Low On-resistance |
| AP2434GN3-HF |
94Kb/4P |
Bottom Exposed DFN, Low On-resistance |
| AP2428GN3 |
179Kb/5P |
Bottom Exposed DFN, Low On-resistance |

International Rectifier
|
IR3575 |
900Kb/23P |
60A Exposed Top Integrated PowIRstage |
| IR3575 |
955Kb/22P |
60A Exposed Top Integrated PowIRstage |
| IR3579 |
82Kb/1P |
60A Exposed-Top Integrated PowIRstage |
| IR3579A |
81Kb/1P |
60A Exposed-Top Integrated PowIRstage |

STATS ChipPAC, Ltd.
|
QFP-EP |
117Kb/2P |
Exposed Pad Quad Flat Pack |

International Rectifier
|
IR3578 |
82Kb/1P |
50A Exposed-Top Integrated PowIRstage |

Maxim Integrated Produc...
|
21-0109B |
35Kb/1P |
PACKAGE OUTLINE, 10L uMAX, EXPOSED PAD Rev B |
| 21-0108 |
71Kb/2P |
PACKAGE OUTLINE, TSSOP 4.4MM BODY, EXPOSED PAD Rev K |

Integrated Device Techn...
|
IDT5P50911 |
131Kb/11P |
8-pin DFN package |

Maxim Integrated Produc...
|
21-0111 |
31Kb/1P |
PACKAGE OUTLINE, 8L SOIC,150 EXPOSED PAD Rev E |

Shenzhen Tuofeng Semico...
|
8820B |
3Mb/4P |
DFN-3x3-8L Plastic-Encapsulate MOSFETS Feb,2018 V1.0 |

Alpha & Omega Semicondu...
|
AON6558 |
94Kb/1P |
DFN 5X6 PACKAGE MARKING DESCRIPTION |