FOOTPRINTS Datasheet(PDF) - 352000 - Aries Electronics, Inc.

Produttore elettronici	Il numero della parte	Scheda tecnica	Spiegazioni elettronici
Aries Electronics, Inc.	352000	695Kb/1P	Converts PLCC packaged IC-to-DIP footprints
Aries Electronics, Inc.	652000	667Kb/1P	Converts PLCC packaged ICs to DIP footprints
Amkor Technology	FUSIONQUAD	394Kb/2P	Increased I/O (116 to 356) in smaller package footprints
Aries Electronics, Inc.	10004HT	1Mb/2P	High-Temp PGA ZIF Test & Burn-in Socket for Footprints on Std 8x8 to 21x21 Grid
ams AG	KSDELLS1.22	1Mb/24P	The TOPLED E1608 expands ams OSRAM’ low power portfolio by offering one of the smallest LED Industry standard footprints in a highly reliable and well proven package concept. Version 1.6 2023-05-12
	KTDELMS1.12	1Mb/23P	The TOPLED E1608 expands ams OSRAM’ low power portfolio by offering one of the smallest LED Industry standard footprints in a highly reliable and well proved package concept. Version 1.8 2022-11-25
	KODELMS1.22	1Mb/23P	The TOPLED E1608 expands ams OSRAM’ low power portfolio by offering one of the smallest LED Industry standard footprints in a highly reliable and well proven package concept. Version 1.6 2023-05-12
	KYDELLS1.22	1Mb/24P	The TOPLED E1608 expands ams OSRAM’ low power portfolio by offering one of the smallest LED Industry standard footprints in a highly reliable and well proved package concept. Version 1.7 2023-05-12
	KODELLS1.22	1Mb/23P	The TOPLED E1608 expands ams OSRAM’ low power portfolio by offering one of the smallest LED Industry standard footprints in a highly reliable and well proven package concept. Version 1.8 2023-05-12

FOOTPRINTS Scheda tecnica, PDF

Link URL :