PLASTIC-ENCAPSULATE Datasheet(PDF) - BC846S_15 - SeCoS Halbleitertechnologie GmbH

Motore di ricerca datesheet componenti elettronici

ALLDATASHEETIT.COM

X

PLASTIC-ENCAPSULATE Scheda tecnica, PDF

: ALL 3M Electronics(11)AAEON Technology(1)Aavid, Thermal Division of Boyd Corporation(1)Abracon Corporation(26)ACE Technology Co., LTD.(3)Adam Technologies, Inc.(13)Advanced Crystal Technology(5)Advanced Photonix, Inc.(24)Advanced Technology Electronics CO., LTD(1)Advanced Thermal Solutions, Inc.(6)AEL Crystals Ltd(4)Aeroflex Circuit Technology(2)Agilent(Hewlett-Packard)(13)AiT Semiconductor Inc.(2)Allied Components International(1)Alpha & Omega Semiconductors(47)Alpha Industries(9)Alpha Wire(17)Altech corporation(2)Amkor Technology(1)Amphenol Communications Solutions(1)Amphenol Corporation(6)Analog Technologies, Inc.(2)API Delevan(1)Arch Electronics Corp.(20)Assmann Electronics Inc.(8)ATMEL Corporation(2)AUK corp(1)Austin Semiconductor(21)AVAGO TECHNOLOGIES LIMITED(30)Avic Technology(37)AVX Corporation(1)Axiomtek Co., Ltd.(3)BaiDu Micro electrons Co., Ltd(1)Banner Engineering Corp.(2)Bedford Opto Technology Ltd.(4)Bel Fuse Inc.(3)Bi technologies(26)Boca Semiconductor Corporation(6)Bourns Electronic Solutions(5)BRIGHT LED ELECTRONICS CORP(1)Broadcom Corporation.(12)Bruckewell Technology LTD(7)Bud Industries, Inc.(13)BusBoard Prototype Systems Ltd.(3)Bytesonic Electronics Co., Ltd.(1)C-Media Electronics(1)Caliber Electronics Inc.(3)California Eastern Labs(8)Carlo Gavazzi Holding AG(2)Central Semiconductor Corp(2)CHENG-YI ELECTRONIC CO., LTD.(13)Chenmko Enterprise Co. Ltd.(5)Cherry Semiconductor Corporation(1)Chongqing Pingwei Enterprise co.,Ltd(45)CITIZEN ELECTRONICS CO., LTD.(1)Comchip Technology(3)Compact Technology Corp.(17)CONEC Elektronische Bauelemente GmbH(53)Continental Device India Limited(158)Copal Electronics(5)Cornell Dubilier Electronics(2)Cree, Inc(1)Crystek Corporation(1)CTS Corporation(5)CUI INC(4)Cystech Electonics Corp.(15)Daya Electric Group Co., Ltd.(59)DB Lectro Inc(1)Delta Electronics, Inc.(4)Digitron Semiconductors(3)Diode Semiconductor Korea(42)Diodes Incorporated(1)DIYI Electronic Technology Co., Ltd.(14)Dongguan City Niuhang Electronics Co.LTD(9)DONGGUAN YOU FENG WEI ELECTRONICS CO., LTD(8)Dubilier(5)E-Tech Electronics LTD(3)Ecliptek Corporation(4)EDAC, All Rights Reserved.(30)EIC discrete Semiconductors(8)EM Microelectronic - MARIN SA(2)Endress+Hauser Group Services AG(1)EPCOS(5)Epson Company(1)ETRI(3)Everlight Electronics Co., Ltd(4)
: More Close

Parola chiave cercata : 'PLASTIC-ENCAPSULATE' - Total: 15069 (1/754) Pages

Produttore elettronici	Il numero della parte	Scheda tecnica	Spiegazioni elettronici
SeCoS Halbleitertechnol...	BC846S	142Kb/1P	Plastic-Encapsulate
Shenzhen Huazhimei Semi...	HM12N02D	988Kb/4P	Plastic-Encapsulate
Jiangsu Changjiang Elec...	2CZ4006	882Kb/4P	Plastic-Encapsulate
SeCoS Halbleitertechnol...	MMDT5401	533Kb/2P	Plastic-Encapsulate
Jiangsu Changjiang Elec...	2CZ4005	815Kb/4P	Plastic-Encapsulate
	2CZ4007	1Mb/4P	Plastic-Encapsulate
	2CZ4004	824Kb/4P	Plastic-Encapsulate
List of Unclassifed Man...	S9013	963Kb/2P	PLASTIC ENCAPSULATE TRANSISTORS
Jiangsu Changjiang Elec...	BZX84C2V4-SOT-23	134Kb/3P	Plastic-Encapsulate Diode
SeCoS Halbleitertechnol...	BAV199	1Mb/2P	Plastic-Encapsulate Diode
	BCX51	1Mb/1P	Plastic-Encapsulate Transistors
	D882	277Kb/2P	Plastic Encapsulate Transistors
Micro Commercial Compon...	MMDT5401	231Kb/3P	Plastic-Encapsulate Transistors
Micro Commercial Compon...	MMDT5401	116Kb/3P	Plastic-Encapsulate Transistors
SeCoS Halbleitertechnol...	2SD2403Q	297Kb/2P	Plastic-Encapsulate Transistor
SeCoS Halbleitertechnol...	BCX19	308Kb/1P	Plastic-Encapsulate Transistor
MAKO SEMICONDUCTOR CO.,...	2SC945	99Kb/2P	Plastic-Encapsulate Transistors
MAKO SEMICONDUCTOR CO.,...	KTC3875	88Kb/2P	Plastic-Encapsulate Transistors
Nanjing International G...	KTA1275	149Kb/1P	Plastic-Encapsulate Transistors
ZP Semiconductor	CJB04N65A	539Kb/2P	Plastic-Encapsulate MOSFETS

1 2 3 4 5 6 7 8 9 10 > >>

1 2 3 4 5 > >>

Cosa è PLASTIC-ENCAPSULATE

L'annima della plastica è un componente elettronico, di solito in un piccolo pacchetto in plastica.

Questi pacchetti sono utilizzati particolarmente nella tecnologia del supporto superficiale e sono progettati per proteggere e proteggere molti tipi di componenti elettronici.

L'annima della plastica presenta i vantaggi di dimensioni ridotte, peso leggero e durata.

Sono anche convenienti, quindi possono essere prodotti in serie e possono essere fabbricati in una varietà di forme e dimensioni.

Per questo motivo, l'ancapsulamento della plastica è ampiamente utilizzato nei prodotti elettronici, in particolare in vari campi come dispositivi mobili, computer e tecnologie di comunicazione.

*Queste informazioni sono solo a scopo informativo generale, non saremo responsabili per eventuali perdite o danni causati dalle informazioni di cui sopra.

Lei ha avuto il aiuto da alldatasheet? [ DONATE ]

Di alldatasheet | Richest di pubblicita | contatti | Privacy Policy | Collegamento alla scheda tecnica | scambio Link | Ricerca produttore
All Rights Reserved©Alldatasheet.com

Mirror Sites English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz

Family Site : ic2ic.com | icmetro.com