| Produttore elettronici | Il numero della parte | Scheda tecnica | Spiegazioni elettronici |

TDK Electronics
|
DEA453960BT-3002B1 |
57Kb/3P |
TDK/Band Pass Filter for UWB |
| C4532X7T2W474K230KE |
9Mb/64P |
TDK MLCC PRODUCT LINE |
| C1005X5R0J475K |
293Kb/1P |
TDK MLCC Capacitance Offering |
| C3225X7S1H106M |
293Kb/1P |
TDK MLCC Capacitance Offering |

Renesas Technology Corp
|
SLG7TD43741 |
2Mb/16P |
TDK Power Strip Sequencer 1 June 21, 2022 |

TDK Electronics
|
GLF2012T-100K |
171Kb/20P |
TDK?셲 New Winding Type Chip Inductor |
| C1608X7S2A104MT |
104Kb/1P |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS |
| C1005X7S2A103MT |
105Kb/1P |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS |
| C1608X7S2A104KT |
104Kb/1P |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS |
| C5750X7S2A106MT |
104Kb/1P |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS |
| C1005X7S2A103KT |
105Kb/1P |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS |
| C2012X7S2A105KT |
105Kb/1P |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS |
| C3216X7S2A225KT |
104Kb/1P |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS |
| C3225X7S2A335MT |
105Kb/1P |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS |
| C4532X7S2A475MT |
105Kb/1P |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS |
| C2012X7S2A105MT |
105Kb/1P |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS |
| C3216X7S2A225MT |
105Kb/1P |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS |
| C3225X7S2A335KT |
105Kb/1P |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS |

Johanson Technology Inc...
|
2450BL15K100 |
74Kb/2P |
2.45 GHz Medium Performance Balun (Compatible with TDK) |
| 2450BL15K050 |
210Kb/2P |
2.45 GHz Medium Performance Balun (Compatible with TDK) |