| Produttore elettronici | Il numero della parte | Scheda tecnica | Spiegazioni elettronici |

Molex Electronics Ltd.
|
0878345021 |
135Kb/3P |
2.54mm (.100) Pitch C-Grid짰 Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13關m (5關) Gold (Au) Flash Plating, Nylon Housing |
| 0879331211 |
355Kb/7P |
1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 100 Circuits, 0.38關m (15關) Gold (Au) Plating, Mating Pin Length 1.65mm (0.065), with Cap |
| 0879333015 |
355Kb/7P |
1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 30 Circuits, 0.05關m (2關) Gold (Au) Plating, Mating Pin Length 3.05mm (0.120), with Cap |
| 0879331007 |
355Kb/7P |
1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 10 Circuits, 0.05關m (2關) Gold (Au) Plating, Mating Pin Length 1.65mm (0.065), with Cap |
| 0877615001 |
308Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 50 Circuits, 0.75關m (30關) Gold (Au) Selective Plating, 10.30mm (.406) Stacking Height |
| 0878320808 |
227Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree 8 Circuits, 0.38關m (15關") Gold (Au) Plating, with Locking Window, Pick-and-Place Cap |
| 0877830202 |
483Kb/7P |
0.60mm (.024) Pitch miniDIMM DDR Socket, Surface Mount, 22.5째 Angle, 0.76關m (30關) Gold (Au) Plating, Off-White Latches, with Pick-and-Place Cap, 200 Circuits |
| 0878343421 |
135Kb/3P |
2.54mm (.100) Pitch C-Grid짰 Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13關m (5關) Gold (Au) Flash Plating, Nylon Housing |
| 0879331215 |
355Kb/7P |
1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 100 Circuits, 0.05關m (2關) Gold (Au) Plating, Mating Pin Length 3.05mm (0.120), with Cap |
| 0901301136 |
596Kb/7P |
2.54mm (.100) Pitch C-Grid III??Header, Dual Row, Vertical, Shrouded, Fully Loaded, 36 Circuits, Black, 3關m (118關) Tin(Sn) over Nickel (Ni), Lead free |
| 0878341045 |
132Kb/3P |
2.54mm (.100) Pitch C-Grid짰 Header, Dual Row, Low Profile, Vertical, Through Hole, Shrouded, Lead-free, 10 Circuits, 0.13關m (5關) Gold (Au) Selective Plating, Black |
| 0877615022 |
237Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 50 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, 5.71mm (.225) Stacking Height |
| 0878315028 |
201Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Vertical, Through Hole, Shrouded, Lead-free, 50 Circuits, 0.38關m (15關) Gold (Au) Plating, Center Polarization Slot, with Locking Windows |
| 0878310841 |
147Kb/3P |
2.00mm (.079) Pitch Milli-Grid??Header, Vertical, Through Hole, Shrouded, Lead-free, 8 Circuits, 0.38關m (15關) Gold (Au) Plating, with Locking Window, without PCB Locator |
| 0877605248 |
171Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 28 Circuits, 2.54關m (100關) Tin (Sn) Plating, Mating Pin Length: 5.75mm (.226), Tube, Lead-free |
| 0878341821 |
135Kb/3P |
2.54mm (.100) Pitch C-Grid짰 Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13關m (5關) Gold (Au) Flash Plating, Nylon Housing |
| 0879394001 |
334Kb/6P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row Dual Body, with Plastic Pegs, 40 Circuits, 0.75關m (30關) Gold (Au) Selective Plating, 6.40mm(.251) |
| 0877601226 |
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 12 Circuits, 0.38關m (15關) Gold (Au) Plating, Mating Pin Length: 3.50mm (.138), Tray, Lead-free |
| 0894858103 |
344Kb/7P |
Universal Serial Bus (USB) Shielded I/O Type A Receptacle, Single Upright, Right Angle, Terminal Length 2.50mm (.098), With Mylar, 0.76關m (30關) Gold (Au) Plating |
| 0878101002 |
314Kb/6P |
1.00mm (.039) Pitch iCool??Low Profile VRM, Vertical, Through Hole, with Tower, with Beveled Metal Pins, 22 Signal, 88 Power, 0.76關m (30關) Gold (Au) Plating |