| Produttore elettronici | Il numero della parte | Scheda tecnica | Spiegazioni elettronici |

Molex Electronics Ltd.
|
0877592074 |
432Kb/8P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 20 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging |
| 0879392000 |
333Kb/6P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row Dual Body, with Plastic Pegs, 20 Circuits, 2.50關m (100關) Tin (Sn) Plating, 15.35mm(.604) Stacking Height |
| 0877591064 |
432Kb/8P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 10 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-and-Place Cap |
| 0877591664 |
432Kb/8P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 16 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-and-Place Cap |
| 0877592064 |
432Kb/8P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 20 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-and-Place Cap |
| 0877593276 |
367Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 32 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Pick-and-Place Cap |
| 0877592464 |
432Kb/8P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 24 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-and-Place Cap |
| 0877594464 |
432Kb/8P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 44 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-and-Place Cap |
| 0878311010 |
197Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Vertical, Through Hole, Shrouded, Lead-free, 10 Circuits, 0.38關m (15關) Gold (Au) Plating, with Center Polarization Slot and Locking Windows |
| 0877596544 |
310Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 44 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Pick-and-Place Cap |
| 0877596533 |
310Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 22 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Pick-and-Place Cap |
| 0877597647 |
367Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 50 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Pick-and-Place Cap |
| 0879160111 |
318Kb/7P |
1.00mm (.039) Pitch DDR-2 DIMM Socket, 22.5 Degree Angle, Through Hole, 240 Circuits, 1.8V Voltage Key, 0.76關m (30關) Gold (Au) Plating, 4.00mm (.157) Tail Length |
| 0877594676 |
367Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 46 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Pick-and-Place Cap |
| 0877593874 |
432Kb/8P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 38 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging |
| 0877594874 |
432Kb/8P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 48 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging |
| 0877591476 |
367Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 14 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Pick-and-Place Cap |
| 0877594076 |
367Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 40 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Pick-and-Place Cap |
| 0877591274 |
432Kb/8P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 12 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging |
| 0877596547 |
310Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 50 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Pick-and-Place Cap |