| Produttore elettronici | Il numero della parte | Scheda tecnica | Spiegazioni elettronici |
Molex Electronics Ltd.
|
0877823007 |
560Kb/8P |
0.60mm (.024) Pitch miniDIMM DDR3 Socket, Vertical, SMT, 0.76關m (30關) Gold (Au) over Nickel, 1.5V, with Pick and Place Cover, 244 Circuits, Type C Tray, Lead free |
| 0877591065 |
292Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 10 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, with Pick-and-Place Cap |
| 0878343492 |
111Kb/3P |
2.54mm (.100) Pitch C-Grid짰 Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 34 Circuits, 0.13關m (5關) Gold (Au) Plating, End Windows, with Pin 5 Voided |
| 0877597629 |
367Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 14 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, with Pick-and-Place Cap |
| 0877823009 |
560Kb/8P |
0.60mm (.024) Pitch miniDIMM DDR3 Socket, Vertical, SMT, 0.76關m (30關) Gold (Au) over Nickel, 1.5V, with Pick and Place Cover, 244 Circuits, Type D Tray, Lead free |
| 0879858050 |
159Kb/2P |
2.00mm (.079) Pitch Milli-Grid??IDT Receptacle, Dual Row, with Center Polarization Key and Embossed Metal Latch, 50 Circuits, 0.38關m (15關) Gold(Au) Plating on contact area |
| 0877592865 |
292Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 28 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, with Pick-and-Place Cap |
| 0877822007 |
560Kb/8P |
0.60mm (.024) Pitch miniDIMM DDR2 Socket, Vertical, SMT, 0.76關m (30關) Gold (Au) over Nickel, 1.8V, with Pick and Place Cover, 244 Circuits, Type C Tray, Lead free |
| 0877597630 |
367Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 16 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, with Pick-and-Place Cap |
| 0879208147 |
1Mb/13P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 14 Circuits, 0.38關m (15關) Gold (Au) Plating, with Pick-and-Place Cap, with Peg, Tube Packaging |
| 0877597633 |
367Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 22 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, with Pick-and-Place Cap |
| 0877591474 |
432Kb/8P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 14 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, with Pick-and-Place Cap |
| 0877822005 |
560Kb/8P |
0.60mm (.024) Pitch miniDIMM DDR2 Socket, Vertical, SMT, 0.76關m (30關) Gold (Au) over Nickel, 1.8V, with Pick and Place Cover, 244 Circuits, Type A Tray, Lead free |
| 0877823005 |
560Kb/8P |
0.60mm (.024) Pitch miniDIMM DDR3 Socket, Vertical, SMT, 0.76關m (30關) Gold (Au) over Nickel, 1.5V, with Pick and Place Cover, 244 Circuits, Type A Tray, Lead free |
| 0877594475 |
292Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 44 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, with Pick-and-Place Cap |
| 0877591875 |
292Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 18 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, with Pick-and-Place Cap |
| 0877592265 |
292Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 22 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, with Pick-and-Place Cap |
| 0877597626 |
367Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 8 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, with Pick-and-Place Cap |
| 0877594675 |
292Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 46 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, with Pick-and-Place Cap |
| 0879858040 |
159Kb/2P |
2.00mm (.079) Pitch Milli-Grid??IDT Receptacle, Dual Row, with Center Polarization Key and Embossed Metal Latch, 40 Circuits, 0.38關m (15關) Gold(Au) Plating on contact area |
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