Produttore elettronici | Il numero della parte | Scheda tecnica | Spiegazioni elettronici |
HARTING Technology Grou...
|
09-38-036-3101 |
508Kb/2P |
Han K 9/9/18-F-C |
09-38-036-3001 |
509Kb/2P |
Han K 9/9/18-M-C Inserts |
OKI electronic componet...
|
MSM5718B70 |
260Kb/40P |
18-Megabit RDRAM (2M x 9) |
Integrated Device Techn...
|
IDT72264 |
392Kb/31P |
VARIABLE WIDTH SUPERSYNCO FIFO 8,192 x 18 or 16,384 x 9 16,384 x 18 or 32,768 x 9 |
Hittite Microwave Corpo...
|
HMC516LC5 |
245Kb/6P |
SMT PHEMT LOW NOISE AMPLIFIER, 9 - 18 GHz |
Mosel Vitelic, Corp
|
MSS0307-1 |
384Kb/39P |
3/ 6/ 9/ 12 / 15 / 18 VOICE ROM |
Peregrine Semiconductor
|
PE42543 |
666Kb/14P |
UltraCMOS SP4T RF Switch 9 kHz-18 GHz |
PE42542 |
668Kb/14P |
UltraCMOS SP4T RF Switch 9 kHz-18 GHz |
Hittite Microwave Corpo...
|
HMC516LC5 |
219Kb/6P |
SMT PHEMT LOW NOISE AMPLIFIER, 9 - 18 GHz |
Integrated Device Techn...
|
IDT72510 |
440Kb/32P |
BUS-MATCHING BIDIRECTIONAL FIFO 512 x 18-BIT . 1024 x 9-BIT 1024 x 18-BIT . 2048 x 9-BIT |
NXP Semiconductors
|
HEF4027BP652 |
108Kb/14P |
Dual JK flip-flop Rev. 9 ??18 November 2011 Rev. 9-18 November 2011 |
Cypress Semiconductor
|
CY7C1363D |
755Kb/22P |
9-Mbit (512 K x 18) Flow-Through SRAM |
Cree, Inc
|
MHB-A |
1Mb/28P |
Flexible 9?멫, 18?멫 or 36?멫 options |
MHB-B |
1Mb/25P |
Flexible 9?멫, 18?멫 or 36?멫 options |
MHD-E |
1Mb/25P |
Flexible 9?멫, 18?멫 or 36?멫 options |
Renesas Technology Corp
|
IDT72V2103 |
496Kb/47P |
3.3 VOLT HIGH-DENSITY SUPERSYNC II™ NARROW BUS FIFO 131,072 x 18/262,144 x 9 262,144 x 18/524,288 x 9 MARCH 2018 |
Cypress Semiconductor
|
CY7C1360 |
895Kb/34P |
9-Mbit (256K x 36/512K x 18) Pipelined SRAM |
CY7C1360C |
423Kb/31P |
9-Mbit (256K x 36/512K x 18) Pipelined SRAM |
CY7C1360C |
521Kb/31P |
9-Mbit (256K x 36/512K x 18) Pipelined SRAM |
Ulti-Mate Connector Inc
|
SD-836110012 |
87Kb/1P |
MICRO-D CIRCUIT CONNECTOR, PLUG, STYLE 18, SIZE 9 CM18R09P02 8-2-13 |