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STM32MP153F Scheda tecnica(PDF) 234 Page - STMicroelectronics |
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STM32MP153F Scheda tecnica(HTML) 234 Page - STMicroelectronics |
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234 / 254 page ![]() Package information STM32MP153C/F 234/254 DS12503 Rev 3 7 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 7.1 TFBGA257 package information This TFBGA is a 257 balls, 10x10 mm, 0.5/0.65 mm pitch, low profile fine pitch ball grid array package Figure 64. TFBGA - Outline 1. Drawing is not to scale. B02Y_ME_V1 D E F1 e1 e2 F2 E2 E1 F1 e2 F2 D2 D1 K H D A B C E F G J L M N P R U T V W A B 1H 1D 1A 1B 1C 1E 1F 1G 1J Peripheral ball matrix pitch 0.5 mm Central ball matrix pitch 0.65 mm 1 2 3 4 5 6 7 8 9 10 11 12 15 13 14 16 17 18 19 1 2 3 4 5 6 7 8 9 A1 ball pad corner b (257 balls) eee M C A B fff M C A A1 A2 SEATING PLANE C ddd C BOTTOM VIEW TOP VIEW SIDE VIEW e1 |
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