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STM32G47PBY3XXX Scheda tecnica(PDF) 196 Page - STMicroelectronics |
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STM32G47PBY3XXX Scheda tecnica(HTML) 196 Page - STMicroelectronics |
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196 / 229 page ![]() Package information STM32G473xB STM32G473xC STM32G473xE 196/229 DS12712 Rev 3 Figure 55. WLCSP81 - recommended footprint Table 106. WLCSP81 - mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to 3 decimal digits. Min Typ Max Min Typ Max A(2) 2. The maximum total package height is calculated by the RSS method (Root Sum Square) using nominal and tolerances values of A1 and A2. - - 0.59 - - 0.023 A1 - 0.18 - - 0.007 - A2 - 0.38 - - 0.015 - A3 - 0.025 - - 0.001 - b 0.22 0.25 0.28 0.009 0.010 0.011 D 4.00 4.02 4.04 0.157 0.158 0.159 E 4.25 4.27 4.29 0.167 0.168 0.169 e - 0.40 - - 0.016 - e1 - 3.20 - - 0.126 - e2 - 3.20 - - 0.126 - F(3) 3. Calculated dimensions are rounded to the 3rd decimal place - 0.410 - - 0.016 - G(3) - 0.535 - - 0.021 - aaa - - 0.10 - - 0.004 bbb - - 0.10 - - 0.004 ccc - - 0.10 - - 0.004 ddd - - 0.05 - - 0.002 eee - - 0.05 - - 0.002 B068_WLCSP81_DIE469_FP_V1 Dpad Dsm |
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