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STM32L552VCU6PTR Scheda tecnica(PDF) 318 Page - STMicroelectronics |
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STM32L552VCU6PTR Scheda tecnica(HTML) 318 Page - STMicroelectronics |
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318 / 340 page  Package information STM32L552xx 318/340 DS12737 Rev 6 Figure 86. WLCSP 81 recommended footprint 1. Dimensions are expressed in millimeters. e - 0.40 - - 0.016 - e1 - 3.20 - - 0.126 - e2 - 3.20 - - 0.126 - F(4) - 0.580 - - 0.023 - G(4) - 0.435 - - 0.017 - aaa - 0.10 - - 0.004 - bbb - 0.10 - - 0.004 - ccc - 0.10 - - 0.004 - ddd - 0.05 - - 0.002 - eee - 0.05 - - 0.002 - 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2. The maximum total package height is calculated by the RSS method (Root Sum Square) using nominal and tolerances values of A1 and A2. 3. Back side coating. Nominal dimension is rounded to the 3rd decimal place resulting from process capability. 4. Calculated dimensions are rounded to the 3rd decimal place. Table 156. WLCSP81 mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max BGA_WLCSP_FT_V1 Dsm Dpad |
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