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STM32WL55JC Scheda tecnica(PDF) 136 Page - STMicroelectronics

Il numero della parte STM32WL55JC
Spiegazioni elettronici  Multiprotocol LPWAN dual core 32-bit Arm® Cortex®-M4/M0 LoRa®, (G)FSK, (G)MSK, BPSK, up to 256KB Flash, 64KB SRAM
PDF  145 Pages
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Produttore elettronici  STMICROELECTRONICS [STMicroelectronics]
Homepage  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32WL55JC Scheda tecnica(HTML) 136 Page - STMicroelectronics

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Package information
STM32WL55/54xx
136/145
DS13293 Rev 1
6
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at www.st.com. ECOPACK
is an ST trademark.
6.1
UFQFPN48 package information
This UFQFPN is a 48 leads, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package.
Figure 30. UFQFPN48 - Outline
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and
solder this back-side pad to PCB ground.
A0B9_ME_V3
D
Pin 1 identifier
laser marking area
EE
D
Y
D2
E2
Exposed pad
area
Z
1
48
Detail Z
R 0.125 typ.
1
48
L
C 0.500x45°
pin1 corner
A
Seating
plane
A1
b
e
ddd
Detail Y
T



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