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SC3200 Scheda tecnica(PDF) 375 Page - Advanced Micro Devices

Il numero della parte SC3200
Spiegazioni elettronici  AMD GEODE-TM SC3200 PROCESSOR
PDF  447 Pages
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Produttore elettronici  AMD [Advanced Micro Devices]
Homepage  http://www.amd.com
Logo AMD - Advanced Micro Devices

SC3200 Scheda tecnica(HTML) 375 Page - Advanced Micro Devices

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AMD Geode™ SC3200 Processor Data Book
375
Electrical Specifications
Revision 5.1
9.2
DC Characteristics
Table 9-10 describes the signal buffer types of the
SC3200. (See Table 3-2 "432-EBGA Ball Assignment -
Sorted by Ball Number" on page 29 and Table 3-4 "481-
TEPBGA Ball Assignment - Sorted by Ball Number" on
page 43) for each signal’s buffer type.)
The subsections that follows provide detailed DC charac-
teristics according to buffer type.
Table 9-10. Buffer Types
Symbol
Description
Reference
Diode
Diodes only, no buffer
---
INAB
Input, ACCESS.bus compatible with Schmitt Trigger
Section 9.2.1
INBTN
Input, TTL compatible with Schmitt Trigger, low leakage
Section 9.2.2
INPCI
Input, PCI compatible
Section 9.2.3
INSTRP
Input, Strap ball (min VIH is 0.6VIO) with weak pull-down
Section 9.2.4
INT
Input, TTL compatible
Section 9.2.5
INTS
Input, TTL compatible with Schmitt Trigger type 200 mV
Section 9.2.6
INTS1
Input, with Schmitt Trigger type 200 mV
Section 9.2.7
INUSB
Input, USB compatible
Section 9.2.8
OAC97
Output, Totem-Pole, AC97 compatible
Section 9.2.9
ODn
Output, Open-Drain, capable of sinking n mA.Note 1
Section 9.2.10
ODPCI
Output, Open-Drain, PCI compatible
Section 9.2.11
Op/n
Output, Totem-Pole, capable of sourcing p mA and sinking n mA
Section 9.2.12
OPCI
Output, PCI compatible, TRI-STATE
Section 9.2.13
OUSB
Output, USB compatible
Section 9.2.14
TSp/n
Output, TRI-STATE, capable of sourcing p mA and sinking n mA
Section 9.2.15
WIRE
Wire, no buffer
---
Note 1.Output from these signals is open-drain and cannot be forced high.



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