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LSM6DSV Scheda tecnica(PDF) 164 Page - STMicroelectronics |
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LSM6DSV Scheda tecnica(HTML) 164 Page - STMicroelectronics |
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164 / 187 page ![]() 18 Soldering information The LGA package is compliant with the ECOPACK and RoHS standard. It is qualified for soldering heat resistance according to JEDEC J-STD-020. For land pattern and soldering recommendations, consult technical note TN0018 available on www.st.com. LSM6DSV Soldering information DS13476 - Rev 2 page 164/187 |
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