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Motore di ricerca datesheet componenti elettronici |
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STM32U595AI Scheda tecnica(PDF) 354 Page - STMicroelectronics |
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STM32U595AI Scheda tecnica(HTML) 354 Page - STMicroelectronics |
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354 / 377 page  Package information STM32U59xxx 354/377 DS13633 Rev 1 Figure 92. UFBGA132 - Recommended footprint e - 0.500 - - 0.0197 - Z - 0.750 - - 0.0295 - ddd - 0.080 - - 0.0031 - eee - 0.150 - - 0.0059 - fff - 0.050 - - 0.0020 - 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 157. UFBGA132 - Recommended PCB design rules (0.5 mm pitch BGA) Dimension Recommended values Pitch 0.5 mm Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.100 mm Ball diameter 0.280 mm Table 156. UFBGA132 - Mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max BGA_WLCSP_FT_V1 Dsm Dpad |
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