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32G431 Scheda tecnica(PDF) 161 Page - STMicroelectronics |
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32G431 Scheda tecnica(HTML) 161 Page - STMicroelectronics |
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161 / 198 page  DS12589 Rev 6 161/198 STM32G431x6 STM32G431x8 STM32G431xB Package information 193 6 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 6.1 UFQFPN32 package information This UFQFPN is a 32-pin, 5 x 5 mm, 0.5 mm pitch ultra thin fine pitch quad flat package. Figure 40. UFQFPN32 - Outline 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this backside pad to PCB ground. A0B8_ME_V3 1 32 PIN 1 Identifier SEATINGPLANE C C ddd A A1 A3 e b D1 b E2 L e E1 E D2 L D |
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