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Motore di ricerca datesheet componenti elettronici |
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Motore di ricerca datesheet componenti elettronici |
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STM32H562AI Scheda tecnica(PDF) 263 Page - STMicroelectronics |
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STM32H562AI Scheda tecnica(HTML) 263 Page - STMicroelectronics |
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263 / 270 page  DS14258 Rev 5 263/270 STM32H562xx and STM32H563xx Package information 265 Figure 95. UFBGA(176+25) - Footprint example eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 139. UFBGA(176+25) - Example of PCB design rules (0.65 mm pitch BGA) Dimension Values Pitch 0.65 mm Dpad 0.300 mm Dsm 0.400 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.300 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.100 mm Table 138. UFBGA(176+25) - Mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. BGA_WLCSP_FT_V1 Dsm Dpad |
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