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ST10F272M Scheda tecnica(PDF) 170 Page - STMicroelectronics |
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ST10F272M Scheda tecnica(HTML) 170 Page - STMicroelectronics |
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170 / 175 page ![]() Package information ST10F272M 170/176 25 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of Second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK® specifications are available at www.st.com. |
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