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STM32G474VCU6 Scheda tecnica(PDF) 203 Page - STMicroelectronics |
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STM32G474VCU6 Scheda tecnica(HTML) 203 Page - STMicroelectronics |
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203 / 232 page ![]() DS12288 Rev 1 203/232 STM32G474xB STM32G474xC STM32G474xE Package information 229 Figure 54. WLCSP - 81 balls, 4.02x4.27 mm, 0.4 mm pitch wafer level chip scale recommended footprint Table 111. WLCSP - 81 balls, 4.02x4.27 mm, 0.4 mm pitch wafer level chip scale mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to 3 decimal digits. Min Typ Max Min Typ Max A(2) 2. The maximum total package height is calculated by the RSS method (Root Sum Square) using nominal and tolerances values of A1 and A2. - - 0.59 - - 0.023 A1 - 0.18 - - 0.007 - A2 - 0.38 - - 0.015 - A3 - 0.025 - - 0.001 - b 0.22 0.25 0.28 0.009 0.010 0.011 D 4.00 4.02 4.04 0.157 0.158 0.159 E 4.25 4.27 4.29 0.167 0.168 0.169 e - 0.40 - - 0.016 - e1 - 3.20 - - 0.126 - e2 - 3.20 - - 0.126 - F(3) 3. Calculated dimensions are rounded to the 3rd decimal place - 0.410 - - 0.016 - G(3) - 0.535 - - 0.021 - aaa - - 0.10 - - 0.004 bbb - - 0.10 - - 0.004 ccc - - 0.10 - - 0.004 ddd - - 0.05 - - 0.002 eee - - 0.05 - - 0.002 |
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