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Motore di ricerca datesheet componenti elettronici |
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STM32F429NET7XXX Scheda tecnica(PDF) 214 Page - STMicroelectronics |
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STM32F429NET7XXX Scheda tecnica(HTML) 214 Page - STMicroelectronics |
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214 / 231 page  Package information STM32F427xx STM32F429xx 214/231 DocID024030 Rev 6 Figure 99. UFBGA176+25 - 201-ball, 10 x 10 mm, 0.65 mm pitch, ultra fine pitch ball grid array package recommended footprint Table 119. UFBGA176+25 recommended PCB design rules (0.65 mm pitch BGA) Dimension Recommended values Pitch 0.65 mm Dpad 0.300 mm Dsm 0.400 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.300 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.100 mm |
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