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LM3241

SNOSB38C – JANUARY 2009 – REVISED NOVEMBER 2017

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Copyright © 2009–2017, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 4

6.1

Absolute Maximum Ratings ...................................... 4

6.2

ESD Ratings.............................................................. 4

6.3

Recommended Operating Conditions ....................... 4

6.4

Thermal Information .................................................. 4

6.5

Electrical Characteristics........................................... 5

6.6

System Characteristics ............................................. 6

6.7

Typical Characteristics .............................................. 7

7

Detailed Description ............................................ 12

7.1

Overview ................................................................. 12

7.2

Functional Block Diagram ....................................... 13

7.3

Feature Description................................................. 13

7.4

Device Functional Modes........................................ 15

8

Application and Implementation ........................ 16

8.1

Application Information............................................ 16

8.2

Typical Application ................................................. 16

9

Power Supply Recommendations ...................... 19

10

Layout................................................................... 19

10.1

Layout Guidelines ................................................. 19

10.2

Layout Example .................................................... 21

11

Device and Documentation Support ................. 22

11.1

Documentation Support ........................................ 22

11.2

Receiving Notification of Documentation Updates 22

11.3

Community Resources.......................................... 22

11.4

Trademarks ........................................................... 22

11.5

Electrostatic Discharge Caution ............................ 22

11.6

Glossary ................................................................ 22

12

Mechanical, Packaging, and Orderable

Information ........................................................... 22

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision B (April 2013) to Revision C

Page

•

Added the Device Information table, ESD Ratings table, Feature Description section, Device Functional Modes

section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device

and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ............................... 1

•

Deleted the maximum lead temperature parameter from the Absolute Maximum Ratings table........................................... 4

•

Changed the minimum TJ and TA from –30°C to –40°C in the Recommended Operating Conditions table ......................... 4

•

Added the Thermal Information table ..................................................................................................................................... 4

•

Added maximum values for VOUT step rise and fall times under –40°C to 85°C TA range in the System

Characteristics table ............................................................................................................................................................... 6

•

Added maximum value for turnon time under –40°C to 85°C TA range in the System Characteristics table ........................ 6