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Motore di ricerca datesheet componenti elettronici |
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Motore di ricerca datesheet componenti elettronici |
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STM32H533CE Scheda tecnica(PDF) 218 Page - STMicroelectronics |
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STM32H533CE Scheda tecnica(HTML) 218 Page - STMicroelectronics |
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218 / 231 page  Package information STM32H533xx 218/231 DS14539 Rev 1 integral heat slug. A distinguish feature is allowable on the bottom surface of the package to identify the terminal A1 corner. Exact shape of each corner is optional. 9. e represents the solder ball grid pitch. 10. N represents the total number of balls on the BGA. 11. Basic dimensions SD and SE are defined with respect to datums A and B. It defines the position of the centre ball(s) in the outer row or column of a fully populated matrix. 12. Values in inches are converted from mm and rounded to 4 decimal digits. 13. Drawing is not to scale. Figure 72. UFBGA100 - Footprint example Table 126. UFBGA100 - Example of PCB design rules (0.5 mm pitch BGA) Dimension Values Pitch 0.50 mm Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the solder mask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 0.125 mm BGA_WLCSP_FT_V1 Dsm Dpad |
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