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Motore di ricerca datesheet componenti elettronici |
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Motore di ricerca datesheet componenti elettronici |
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ST7263BEx Scheda tecnica(PDF) 171 Page - STMicroelectronics |
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ST7263BEx Scheda tecnica(HTML) 171 Page - STMicroelectronics |
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171 / 186 page  ST7263Bxx Package characteristics Doc ID 7516 Rev 8 171/186 14.2 Thermal characteristics 14.3 Soldering and glueability information Recommended glue for SMD plastic packages dedicated to molding compound with silicone: ● Heraeus: PD945, PD955 ● Loctite: 3615, 3298 Table 85. Thermal characteristics Symbol Ratings Value Unit RthJA Package thermal resistance (junction to ambient) SDIP32 SO34 SO24 LQFP48 QFN40 60 75 70 80 34 °C/W PD Power dissipation(1) 1. The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA. The power dissipation of an application can be defined by the user with the formula: PD=PINT + PPORT where PINT is the chip internal power (IDD x VDD) and PPORT the port power dissipation depending on the ports used in the application. 500 mW TJmax Maximum junction temperature(2) 2. The maximum chip-junction temperature is based on technology characteristics. 150 °C |
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