L9803 datasheet(124/126 Pages) STMICROELECTRONICS

124 / 126 page

Package information

L9803

124/126

Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 53. HiQUAD-64 Mechanical Data & Package Dimensions

HiQUAD-64

DIM.

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

3.15

0.124

0.25

0.010

2.50

2.90

0.10

0.114

0.10

0.004

0.22

0.38

0.008

0.015

0.23

0.32

0.009

0.012

17.00

17.40

0.669

0.685

D1 (1)

13.90

14.00

14.10

0.547

0.551

0.555

2.65

2.80

2.95

0.104

0.110

0.116

17.00

17.40

0.669

0.685

E1 (1)

13.90

14.00

14.10

0.547

0.551

0.555

0.65

0.025

2.35

2.65

0.092

0.104

9.30

9.50

9.70

0.366

0.374

0.382

13.30

13.50

13.70

0.523

0.531

0.539

0.10

0.004

0.12

0.005

0.80

1.10

0.031

0.043

N10

°(max.)

0°(min.), 7˚(max.)

(1): "D1" and "E1" do not include mold flash or protusions

- Mold flash or protusions shall not exceed 0.15mm(0.006inch) per side

POQU64ME

E4 (slug lenght)

Gauge Plane

0.35

slug

(bottom side)

COPLANARITY

⊕ F

BOTTOM VIEW

SEATING PLANE

OUTLINE AND

MECHANICAL DATA

L9803 Scheda tecnica(PDF) 124 Page - STMicroelectronics

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