AFS090 datasheet(257/334 Pages) MICROSEMI

257 / 334 page

Fusion Family of Mixed Signal FPGAs

R e visio n 2

3 -7

Thermal Characteristics

Introduction

The temperature variable in the Microsemi Designer software refers to the junction temperature, not the

ambient, case, or board temperatures. This is an important distinction because dynamic and static power

consumption will cause the chip's junction temperature to be higher than the ambient, case, or board

temperatures. EQ 1 through EQ 3 give the relationship between thermal resistance, temperature

gradient, and power.

EQ 1

EQ 2

EQ 3

where

θJA = Junction-to-air thermal resistance

θJB = Junction-to-board thermal resistance

θJC = Junction-to-case thermal resistance

= Junction temperature

TA = Ambient temperature

TB = Board temperature (measured 1.0 mm away from the

package edge)

TC = Case temperature

= Total power dissipated by the device

Table 3-6 • Package Thermal Resistance

Product

Die Size

Units

(mm)

Still Air

1.0 m/s

2.5 m/s

AFS090-QN108

X = 3.4; Y = 4.8

34.5

30.0

27.7

8.1

16.7

°C/W

AFS090-QN180

X = 3.4; Y = 4.8

33.3

27.6

25.7

9.2

21.2

°C/W

AFS250-QN180

X = 4.0; Y = 5.6

32.2

26.5

24.7

5.7

15.0

°C/W

AFS250-PQ208

TBD

°C/W

AFS600-PQ208

TBD

°C/W

AFS090-FG256

X = 3.4; Y = 4.8

37.7

33.9

32.2

11.5

29.7

°C/W

AFS250-FG256

X = 4.0; Y = 5.6

33.7

30.0

28.3

9.3

24.8

°C/W

AFS600-FG256

X = 5.10; Y = 7.3

28.9

25.2

23.5

6.8

19.9

°C/W

AFS1500-FG256

X = 7.62; Y = 9.98

23.3

19.6

18.0

4.3

14.2

°C/W

AFS600-FG484

X = 5.10; Y = 7.3

21.8

18.2

16.7

7.7

16.8

°C/W

AFS1500-FG484

X = 7.62; Y = 9.98

21.6

16.8

15.2

5.6

14.9

°C/W

AFS1500-FG676

TBD

°C/W

TJ θA

–

------------------

TJ TB

–

-------------------

TJ TC

–

-------------------

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