SN74LV32ADE4 datasheet(5/28 Pages) TI1

Il numero della parte	SN74LV32ADE4

Spiegazioni elettronici	Quadruple 2-Input Positive-Or Gates

PDF	28 Pages

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Produttore elettronici	TI1 [Texas Instruments]

Homepage	http://www.ti.com

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5 / 28 page

SN74LV32A

www.ti.com

SCLS385K – SEPTEMBER 1997 – REVISED DECEMBER 2014

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VCC

Supply voltage

2

5.5

V

VCC = 2 V

1.5

VCC = 2.3 to 2.7 V

VCC × 0.7

VIH

High-level input voltage

V

VCC = 3 V to 3.6 V

VCC × 0.7

VCC = 4.5 V to 5.5 V

VCC × 0.7

VCC = 2 V

0.5

VCC = 2.3 to 2.7 V

VCC × 0.3

VIL

Low-level input voltage

V

VCC = 3 V to 3.6 V

VCC × 0.3

VCC = 4.5 V to 5.5 V

VCC × 0.3

VI

Input voltage

0

5.5

V

VO

Output voltage

0

VCC

V

VCC = 2 V

–50

µA

VCC = 2.3 to 2.7 V

–2

IOH

High-level output current

VCC = 3 V to 3.6 V

–6

mA

VCC = 4.5 V to 5.5 V

–12

VCC = 2 V

50

µA

VCC = 2.3 to 2.7 V

2

IOL

Low-level output current

VCC = 3 V to 3.6 V

6

mA

VCC = 4.5 V to 5.5 V

12

VCC = 2.3 to 2.7 V

200

∆t/∆v

Input transition rise or fall rate

VCC = 3 V to 3.6 V

100

ns/V

VCC = 4.5 V to 5.5 V

20

TA

Operating free-air temperature

–40

125

°C

(1)

All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs (SCBA004).

7.4 Thermal Information

SN74LV32A

THERMAL METRIC(1)

D

DBV

DVG

NS

PW

RGY

UNIT

14 PINS

RθJA

Junction-to-ambient thermal resistance

90.6

107.1

129.0

90.7

122.6

57.5

RθJC(top)

Junction-to-case (top) thermal resistance

50.9

59.6

52.1

48.3

51.4

70.8

RθJB

Junction-to-board thermal resistance

44.8

54.4

62.0

49.4

64.4

33.6

Junction-to-top characterization

ψJT

14.7

20.5

6.5

14.6

6.7

3.4

°C/W

parameter

Junction-to-board characterization

ψJB

44.5

53.8

61.3

49.1

63.8

33.7

parameter

Junction-to-case (bottom) thermal

RθJC(bot)

—

13.9

resistance

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).

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