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STM32F745VG Scheda tecnica(PDF) 202 Page - STMicroelectronics |
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STM32F745VG Scheda tecnica(HTML) 202 Page - STMicroelectronics |
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202 / 227 page ![]() Package information STM32F745xx STM32F746xx 202/227 DocID027590 Rev 4 6.3 WLCSP143, 4.539x 5.849 mm, 0.4 mm pitch wafer level chip scale package information Figure 85. WLCSP143, 4.539x 5.849 mm, 0.4 mm pitch wafer level chip scale package outline 1. Drawing is not to scale. Table 115. WLCSP143, 4.539x 5.849 mm, 0.4 mm pitch wafer level chip scale package mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.525 0.555 0.585 0.0207 0.0219 0.0230 A1 - 0.175 - - 0.0069 - |
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