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STM32L071VB Scheda tecnica(PDF) 121 Page - STMicroelectronics |
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STM32L071VB Scheda tecnica(HTML) 121 Page - STMicroelectronics |
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121 / 136 page ![]() DocID027101 Rev 3 121/136 STM32L071xx Package information 133 Device marking for WLCSP49 The following figure gives an example of topside marking versus ball A 1 position identifier location. Figure 52. WLCSP49 marking example (package top view) 1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering samples in production. ST Quality has to be contacted prior to any decision to use these Engineering samples to run qualification activity. Table 83. WLCSP49 recommended PCB design rules (0.4 mm pitch) Dimension Recommended values Pitch 0.4 Dpad 260 µm max. (circular) 220 µm recommended Dsm 300 µm min. (for 260 µm diameter pad) PCB pad design Non-solder mask defined via underbump allowed. |
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