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STM32F413RG Scheda tecnica(PDF) 179 Page - STMicroelectronics |
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STM32F413RG Scheda tecnica(HTML) 179 Page - STMicroelectronics |
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179 / 207 page ![]() DocID029162 Rev 2 179/207 STM32F413xG/H Package information 205 7.2 UFQFPN48 package information Figure 66. UFQFPN48 - 48-lead, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package outline 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this back-side pad to PCB ground. |
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