| Motore di ricerca datesheet componenti elettronici |
|
STM32F413RG Scheda tecnica(PDF) 197 Page - STMicroelectronics |
|
|
|||||||||||||||||||||||||||||
STM32F413RG Scheda tecnica(HTML) 197 Page - STMicroelectronics |
|
197 / 207 page ![]() DocID029162 Rev 2 197/207 STM32F413xG/H Package information 205 Figure 82. UFBGA144 - 144-pin, 10 x 10 mm, 0.80 mm pitch, ultra fine pitch ball grid array recommended footprint Note: Non solder mask defined (NSMD) pads are recommended. 4 to 6 mils solder paste screen printing process. Stencil opening is 0.400 mm. Stencil thickness is between 0.100 mm and 0.125 mm. Pad trace width is 0.120 mm. F 0.550 0.600 0.650 0.0177 0.0197 0.0217 ddd - - 0.080 - - 0.0039 eee - - 0.150 - - 0.0059 fff - - 0.080 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 111. UFBGA144 recommended PCB design rules (0.80 mm pitch BGA) Dimension Recommended values Pitch 0.80 mm Dpad 0.400 mm Dsm 0.550 mm typ. (depends on the soldermask registration tolerance) Table 110. UFBGA144 - 144-ball, 10 x 10 mm, 0.80 mm pitch, ultra fine pitch ball grid array package mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. |
|
Link URL |
| Lei ha avuto il aiuto da alldatasheet? [ DONATE ] |
Di alldatasheet | Richest di pubblicita | contatti | Privacy Policy | Collegamento alla scheda tecnica | scambio Link | Ricerca produttore All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |