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STM32F302XD Scheda tecnica(PDF) 151 Page - STMicroelectronics |
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STM32F302XD Scheda tecnica(HTML) 151 Page - STMicroelectronics |
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151 / 168 page ![]() DocID026900 Rev 4 151/168 STM32F302xD STM32F302xE Package information 166 7.3 UFBGA100 package information UFBGA100 is a 100-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array package. Figure 57. UFBGA100 package outline 1. Drawing is not to scale. Table 93. UFBGA100 package mechanical data Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. A 0.460 0.530 0.600 0.0181 0.0209 0.0236 A1 0.050 0.080 0.110 0.0020 0.0031 0.0043 A2 0.400 0.450 0.500 0.0157 0.0177 0.0197 A3 - 0.130 - - 0.0051 - A4 0.270 0.320 0.370 0.0106 0.0126 0.0146 b 0.200 0.250 0.300 0.0079 0.0098 0.0118 D 6.950 7.000 7.050 0.2736 0.2756 0.2776 D1 5.450 5.500 5.550 0.2146 0.2165 0.2185 E 6.950 7.000 7.050 0.2736 0.2756 0.2776 E1 5.450 5.500 5.550 0.2146 0.2165 0.2185 e - 0.500 - - 0.0197 - F 0.700 0.750 0.800 0.0276 0.0295 0.0315 |
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