STM32L152VC-A datasheet(127/134 Pages) STMICROELECTRONICS

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STM32L151xC/C-A STM32L152xC/C-A

Package information

133

Figure 44. WLCSP64, 0.4 mm pitch wafer level chip scale package

recommended footprint

b(2)

0.240

0.270

0.300

0.0094

0.0106

0.0118

4.504

4.539

4.574

0.1773

0.1787

0.1801

4.876

4.911

4.946

0.1920

0.1933

0.1947

0.400

0.0157

2.800

0.1102

0.870

0.0343

1.056

0.0416

aaa

0.100

0.0039

bbb

0.100

0.0039

ccc

0.100

0.0039

ddd

0.050

0.0020

eee

0.050

0.0020

1. Values in inches are converted from mm and rounded to 4 decimal digits.

2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.

Table 70. WLCSP64, 0.4 mm pitch package recommended PCB design rules

Dimension

Recommended values

Pitch

0.4

Dpad

260 µm max. (circular)

220 µm recommended

Dsm

300 µm min. (for 260 µm diameter pad)

PCB pad design

Non-solder mask defined via underbump allowed.

Table 69. WLCSP64, 0.4 mm pitch wafer level chip scale package mechanical data

(continued)

Symbol

millimeters

inches(1)

Min

Typ

Max

Min

Typ

Max

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