STM32F779IIK7 datasheet(243/255 Pages) STMICROELECTRONICS

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STM32F779IIK7 Scheda tecnica(PDF) 243 Page - STMicroelectronics

Il numero della parte	STM32F779IIK7

Spiegazioni elettronici	Dual mode Quad-SPI

PDF	255 Pages

Scroll/Zoom	100%

Produttore elettronici	STMICROELECTRONICS [STMicroelectronics]

Homepage	http://www.st.com

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243 / 255 page

DocID028294 Rev 4

243/255

STM32F777xx STM32F778Ax STM32F779xx

Package information

254

Figure 96. WLCSP 180-bump, 5.5 x 6 mm, 0.4 mm pitch wafer level chip scale

package recommended footprint

1. Dimensions are expressed in millimeters.

Table 130. WLCSP 180-bump, 5.5 x 6 mm, recommended PCB design rules

(0.4 mm pitch)

Dimension

Recommended values

Pitch

0.4

Dpad

0.225 mm

Dsm

0.290 mm typ. (depends on the soldermask

registration tolerance)

Stencil opening

0.250 mm

Stencil thickness

0.1 mm

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