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  • 54ABT373CPCX

  • AI
    The **54ABT373CPCX** is a high-performance, radiation-tolerant integrated circuit primarily used in military and aerospace applications. It belongs to the **Advanced BiCMOS Technology (ABT)** family. --- ### ## 1. Basic Device Definition The 54ABT373 is an **Octal Transparent Latch** with 3-state (TRI-STATE) outputs. It is designed for driving high-capacitance loads or low-impedance backplanes in high-speed systems. | Specification | Details | | :--- | :--- | | **Logic Family** | ABT (Advanced BiCMOS) | | **Function** | Octal D-Type Latch | | **Output Type** | 3-State (High, Low, High-Impedance) | | **Package Type** | CP (Ceramic Flatpack) | | **Operating Temp Range** | -55°C to +125°C (Military Grade) | --- ### ## 2. Pin Configuration and Logic The device consists of eight D-type latches. When the Latch Enable (LE) is high, the Q outputs follow the Data (D) inputs. When LE goes low, the data is latched. #### **Truth Table** | Inputs (OE) | Inputs (LE) | Inputs (D) | Output (Q) | State | | :---: | :---: | :---: | :---: | :--- | | L | H | H | H | Transparent | | L | H | L | L | Transparent | | L | L | X | $Q_0$ | Latched | | H | X | X | Z | High Impedance | *Key: H = High, L = Low, X = Don't Care, Z = High Impedance, $Q_0$ = Previous State.* --- ### ## 3. Key Electronic Characteristics The "ABT" technology combines the low power consumption of CMOS with the high-speed drive capability of Bipolar transistors. * **High Drive Capability:** Typically provides 32mA (Source) and 64mA (Sink) current, making it ideal for bus driving. * **Low Power Consumption:** Uses CMOS input stages to minimize static power dissipation. * **Voltage Range:** Operates at a standard 5V supply ($V_{CC}$). * **Propagation Delay:** extremely fast, typically in the range of 3ns to 5ns. * **Power-Up/Down Protection:** The outputs are designed to be in a high-impedance state during power-up/down to prevent system glitches. --- ### ## 4. Common Applications Due to the **54** prefix and the **CP** (Ceramic) packaging, this part is specifically intended for: 1. **Avionics:** Flight control systems where extreme temperature stability is required. 2. **Space/Satellite:** High reliability in harsh environments. 3. **Data Buffering:** Interfacing between microprocessors and high-speed data buses. 4. **Memory Interfacing:** Used to hold addresses for static memory components. ---
    ✨ Follow-up Questions
    • ⤷ What is the difference between the 54ABT373 and the 74ABT373?
    • ⤷ What are the specific thermal characteristics of the Ceramic Flatpack (CP) package?
    • ⤷ Can this chip be used in 3.3V logic systems without level shifters?