7140LA55CB
AI

The **7140LA55CB** is a high-speed, low-power CMOS Dual-Port Static RAM (SRAM) manufactured by IDT (Integrated Device Technology, now part of Renesas). This specific part is designed for military or high-reliability applications, as indicated by the "CB" suffix.
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### 1. General Specifications
Below are the primary technical characteristics of the 7140LA55CB:
| Feature | Specification |
| :--- | :--- |
| **Memory Capacity** | 8K bits (1K x 8 bits) |
| **Memory Type** | Dual-Port Static RAM (SRAM) |
| **Access Time** | 55 ns (nanoseconds) |
| **Voltage Supply** | 5V (±10%) |
| **Power Consumption** | Low Power ("LA" version) |
| **Package Type** | Sidebraze Dual-In-Line Package (DIP) - 48 Pins |
| **Operating Temp** | Military Range (-55°C to +125°C) |
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### 2. Key Functional Features
The 7140 series is unique because it allows **asynchronous access** to the same memory location from two separate ports.
* **Independent Control:** Each port (Left and Right) has its own independent Control, Address, and I/O pins. This allows for simultaneous reads or writes.
* **Arbitration Logic:** It includes on-chip hardware for "Busy" logic to handle instances where both ports attempt to write to the same address simultaneously.
* **Interrupt Logic:** It features semaphore signaling to allow communication between two processors using the memory space.
* **Technology:** Manufactured using high-performance CMOS technology, which ensures high speed with significantly lower power consumption than traditional bipolar TTL parts.
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### 3. Pinout Structure (High Level)
The 48-pin configuration is organized to provide dual paths:
1. **Address Lines ($A_{0L} - A_{9L}$ and $A_{0R} - A_{9R}$):** Separate address inputs for left and right ports.
2. **Data I/O ($I/O_{0L} - I/O_{7L}$ and $I/O_{0R} - I/O_{7R}$):** 8-bit bidirectional data lines for each port.
3. **Control Signals:**
* $\overline{CE}$: Chip Enable
* $\overline{OE}$: Output Enable
* $R/\overline{W}$: Read/Write Control
* $\overline{BUSY}$: Hardware arbitration signal
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### 4. Application Use Cases
Because this is a "CB" grade (Ceramic Sidebraze) part, it is typically found in:
* **Military Systems:** Avionics, radar processing, and guidance systems.
* **Multi-Processor Systems:** Acting as a "mailbox" or buffer between two different CPUs.
* **Digital Signal Processing (DSP):** High-speed data buffering between a controller and a processor.
- ⤷
What is the difference between the 'LA' and 'L' power versions of this IC?
- ⤷ How does the 'Busy' logic handle simultaneous write operations?
- ⤷ Are there modern SMD equivalents for this through-hole ceramic package?