The **ATS-01A-03-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components like CPUs, GPUs, and high-power MOSFETs. ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 40mm x 40mm x 15mm | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Thermal Resistance** | 15.90°C/W (at 200 LFM) | | **Airflow Path** | Horizontal (Straight Fin) | | **Thermal Interface Material (TIM)** | T766 (High Performance) | --- ### 2. Key Design Components #### A. Fin Geometry (Straight Fin) The heat sink features a straight fin design. This is optimized for **forced convection** (airflow from fans). The spacing between fins is calculated to minimize pressure drop while maximizing the surface area available for heat dissipation. #### B. Attachment Mechanism (Push Pins) Instead of using adhesive tape, this part uses pre-drilled holes in the PCB and a spring-loaded push pin system. * **Benefits:** Provides consistent downward pressure, improving the contact between the component and the heat sink. * **Reliability:** Resistant to shock and vibration compared to "peel-and-stick" solutions. #### C. Thermal Interface Material (TIM) The "C2" suffix indicates that it comes pre-applied with **T766 thermal grease**. * **Function:** Fills microscopic air gaps between the heat sink base and the electronic chip. * **Efficiency:** Ensures the lowest possible thermal resistance at the contact interface. --- ### 3. Application Use Cases This specific heat sink size (40x40mm) is commonly used in: * **Network Switches/Routers:** Cooling ASICs and processors. * **Industrial PCs:** Cooling embedded chips in high-temperature environments. * **Power Supplies:** Heat dissipation for power transistors.