The **ATS-01A-60-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is designed for cooling electronic components, such as CPUs, GPUs, or power modules, using forced air (fan) or natural convection. --- ### 1. Technical Specifications The part number itself contains specific data regarding its dimensions and material properties. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimension L x W** | 40mm x 40mm | | **Height (Fin)** | 25mm | | **Thermal Resistance** | 6.06°C/W (at 200 LFM) | | **Number of Fins** | Straight Fin Design | --- ### 2. Key Components & Features #### A. The Heat Sink Body The body is constructed from **Aluminum 6063**, which is the industry standard for thermal conductivity and weight efficiency. The "Blue Anodized" finish isn't just for aesthetics; it provides: * Increased surface emissivity for better radiation. * Protection against corrosion. * Electrical insulation properties. #### B. The Attachment System (Push-Pins) This model uses a **Plastic Push-Pin** mechanism combined with a compression spring. * **Ease of Assembly:** Allows for tool-free installation on a PCB. * **Constant Pressure:** The spring ensures that the heat sink maintains firm contact with the electronic chip, which is critical for minimizing thermal interface resistance. #### C. Thermal Interface Material (TIM) The "R0" at the end of the part number typically indicates that the product comes with **pre-applied Thermal Interface Material**. This is a phase-change material or a thermal pad that fills the microscopic air gaps between the component and the heat sink. --- ### 3. Thermal Performance Profile Thermal resistance measures how effectively the part moves heat away from the silicon. Performance varies based on airflow: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 6.06 | | **400 (2.0 m/s)** | 3.33 | | **600 (3.0 m/s)** | 2.50 | --- ### 4. Application Use Cases * **BGA Cooling:** Ideal for Ball Grid Array (BGA) chips found on motherboards. * **Power Supplies:** Used to cool MOSFETs or voltage regulators. * **Embedded Systems:** Suitable for industrial PCs and networking hardware where vertical space allows for a 25mm height.