The **ATS-01B-172-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like processors, FPGAs, and ASICs. ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 30mm x 30mm x 15mm | | **Thermal Resistance** | 5.76°C/W (at 200 LFM) | | **Attachment Method** | Push Pin (Brass) | | **Spring Type** | Compression Spring | | **Fin Style** | XC-Cut (Cross-cut) | --- ### 2. Key Electronic & Mechanical Components #### A. XC-Cut Fin Design The "XC-Cut" refers to a cross-cut fin geometry. In electronic cooling, this design is superior to standard straight fins because: * It allows for multi-directional airflow. * It increases the surface area for heat dissipation. * It creates turbulence in the air, which helps strip away the "boundary layer" of hot air sticking to the metal. #### B. Push Pin Attachment Mechanism Unlike adhesive tapes which can degrade over time, the ATS-01B-172-C2-R0 uses a mechanical attachment: * **Brass Push Pins:** Provides a secure, vibration-resistant connection to the PCB. * **Compression Springs:** These ensure a precise amount of downward pressure (force) is applied to the electronic chip. This optimizes the thermal interface between the chip and the heat sink. #### C. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the part comes with a pre-applied thermal interface material or is compatible with specific high-performance phase-change materials. This fills microscopic air gaps between the component and the heat sink to maximize heat transfer. --- ### 3. Thermal Performance Analysis The efficiency of this part is highly dependent on the velocity of the air flowing through the system (measured in Linear Feet per Minute - LFM). | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural) | 11.07 | | 200 | 5.76 | | 400 | 4.07 | | 600 | 3.23 | --- ### 4. Typical Applications * **Embedded Systems:** Cooling small form-factor CPUs. * **Telecommunications:** Dissipating heat from high-speed networking chips. * **Power Electronics:** Managing heat for voltage regulators or power converters.