The **ATS-01D-04-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "superGRIP" series, designed specifically for cooling electronic components such as processors, FPGAs, and ASICs. ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (High Thermal Conductivity) | | **Fin Style** | Straight Fin | | **Attachment Method** | superGRIP (Clip-on) | | **Thermal Resistance** | 11.58 °C/W @ 200 LFM | | **Dimensions** | 40mm x 40mm x 9.5mm | | **Finish** | Blue Anodized | --- ### 2. Component Breakdown #### A. The Heat Sink Body The main body is made of **Blue Anodized Aluminum**. The anodized surface is not just for aesthetics; it provides: * **Corrosion Resistance:** Protects the aluminum from oxidation. * **Electrical Insulation:** The coating is non-conductive, reducing the risk of short circuits if a component makes accidental contact. * **Improved Emissivity:** Enhances heat radiation compared to bare metal. #### B. The Fin Geometry This model uses **Straight Fins**. * **Design:** The vertical fins increase the surface area available for heat dissipation. * **Airflow:** It is optimized for forced-air cooling (fan-driven) where air can pass linearly through the channels. #### C. The superGRIP™ Attachment System This is the most critical "part" of the assembly. Unlike thermal adhesive tape or push-pins that require holes in the PCB, the superGRIP uses: 1. **Plastic Frame:** A high-strength clip that surrounds the electronic component. 2. **Metal Spring Clip:** A "horseshoe" shaped stainless steel clip that applies consistent downward pressure. 3. **Thermal Interface Material (TIM):** Usually comes pre-applied or paired with a high-performance phase-change material to fill microscopic air gaps between the chip and the heat sink. --- ### 3. Electronic Application This part is typically used to manage the thermal profile of: * **BGA (Ball Grid Array) Packages:** Common in networking hardware. * **FPGAs:** Which generate high heat in concentrated areas. * **Video Processors:** In embedded systems or industrial computers. --- ### 4. Thermal Performance Data The cooling efficiency depends on the velocity of the air (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200** | 11.58 | | **300** | 7.11 | | **400** | 5.66 | | **500** | 4.89 |