The **ATS-01D-06-C3-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their *blueICE*™ series, designed primarily for cooling high-power electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Mounting Type** | Push-Pin (2-Pin) | | **Dimensions (L x W)** | 40mm x 40mm | | **Height** | 25mm | | **Thermal Resistance** | ~2.50°C/W (at 200 LFM) | | **Attachment Style** | Plastic Push-Pins with Brass Springs | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the component's features: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **01D**: Series identifier (specific fin geometry/design). * **06**: Size/Dimension code (corresponds to the 40x40mm footprint). * **C3**: Material and Thermal Interface Material (TIM) code. Usually indicates a specific pre-applied thermal pad or grease. * **R0**: RoHS compliance and revision status. --- ### 3. Key Electronic Functions While the heatsink itself is a passive mechanical part, its role in an electronic system is critical for: 1. **Thermal Management**: It increases the surface area of the heat-generating component, allowing for efficient heat dissipation into the surrounding air. 2. **Reliability**: By keeping the junction temperature ($T_j$) of a semiconductor low, it prevents thermal throttling and extends the lifespan of the electronic part. 3. **Mechanical Stability**: The push-pin mounting system ensures constant pressure between the heatsink and the component, maintaining optimal contact with the Thermal Interface Material (TIM). --- ### 4. Application Examples This specific size (40x40x25mm) is commonly used for: * **Network Switches/Routers**: Cooling ASICs and processors. * **Industrial PCs**: Heat dissipation for embedded chipsets. * **Power Supplies**: Cooling MOSFETs or rectifiers in high-density power modules.