The **ATS-01H-100-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). While it is a mechanical component, it is a critical part of electronic thermal management systems, specifically designed for high-density cooling requirements. --- ## Technical Specifications The following table outlines the key physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 4.84°C/W (at 100 LFM) | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Fin Style** | Straight Fin | | **Spring Type** | ATS-PPS-01 | --- ## Component Breakdown ### 1. Thermal Interface Material (TIM) This specific part comes pre-assembled with **T766 phase change material**. This eliminates the need for manual application of thermal paste, ensuring a uniform contact layer between the electronic component (CPU, FPGA, or GPU) and the heat sink base. ### 2. Push-Pin Attachment Mechanism Instead of using adhesive tape or screws, this model uses a **push-pin and spring** system. * **Reliability:** Provides constant pressure for better thermal transfer. * **Safety:** The springs prevent over-tightening which could crack the PCB or the silicon die. * **Compatibility:** Designed for pre-drilled holes in a PCB (typically 3.0mm diameter). ### 3. Airflow Efficiency The "Straight Fin" design is optimized for **forced-air cooling** (fan-driven systems). The blue anodized finish is not just for aesthetics; it provides surface protection and slightly improves radiation heat transfer. --- ## Typical Applications This heat sink is commonly found in: * **Embedded Systems:** Cooling high-speed processors. * **Telecommunications:** Cooling ASICs in network switches. * **Power Electronics:** Managing heat in large voltage regulators. ---