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  • ATS-02A-159-C2-R0

  • AI
    The **ATS-02A-159-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" attachment series designed for cooling electronic components such as CPUs, GPUs, and power modules. --- ### ## Technical Specifications Below are the primary electronic and physical characteristics of the part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic) | | **Thermal Resistance** | 2.09°C/W @ 200 LFM | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 20.00mm | | **Flow Direction** | XC (Cross-cut) | --- ### ### Key Electronic Components & Design Features #### 1. Thermal Management Efficiency The device is designed to dissipate heat from surface-mount technology (SMT) components. The "C2" in the part number indicates a specific thermal interface material (TIM) or finish, ensuring maximum heat transfer from the silicon die to the aluminum fins. #### 2. Cross-Cut (XC) Fin Design Unlike straight-fin heat sinks, the **XC design** allows for multi-directional airflow. This is critical in crowded PCB environments where air might not flow in a single linear path. #### 3. Push Pin Mounting The part utilizes a standardized hole pattern (typically 38mm spacing for this size). The use of plastic push-pins with integrated springs provides: * **Constant Pressure:** Ensures the heat sink remains in firm contact with the electronic component. * **Vibration Resistance:** The spring tension prevents the component from shifting during shipping or operation. #### 4. Blue Anodized Coating The blue anodization is not just aesthetic; it increases **surface emissivity**. In electronics, a coated surface radiates heat more effectively than bare polished aluminum, aiding in passive cooling when fans are at low speeds. --- ### ### Typical Applications * **BGA Cooling:** Ball Grid Array processors. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **Telecommunications:** High-speed networking switches and routers.
    ✨ Follow-up Questions
    • ⤷ What is the specific hole-to-hole spacing required for this heat sink?
    • ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied TIM?
    • ⤷ How does the thermal resistance change at higher airflow rates (e.g.
    • ⤷ 600 LFM)?