ATS-02A-159-C2-R0
AI

The **ATS-02A-159-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" attachment series designed for cooling electronic components such as CPUs, GPUs, and power modules.
---
### ## Technical Specifications
Below are the primary electronic and physical characteristics of the part:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push Pin (Plastic) |
| **Thermal Resistance** | 2.09°C/W @ 200 LFM |
| **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 20.00mm |
| **Flow Direction** | XC (Cross-cut) |
---
### ### Key Electronic Components & Design Features
#### 1. Thermal Management Efficiency
The device is designed to dissipate heat from surface-mount technology (SMT) components. The "C2" in the part number indicates a specific thermal interface material (TIM) or finish, ensuring maximum heat transfer from the silicon die to the aluminum fins.
#### 2. Cross-Cut (XC) Fin Design
Unlike straight-fin heat sinks, the **XC design** allows for multi-directional airflow. This is critical in crowded PCB environments where air might not flow in a single linear path.
#### 3. Push Pin Mounting
The part utilizes a standardized hole pattern (typically 38mm spacing for this size). The use of plastic push-pins with integrated springs provides:
* **Constant Pressure:** Ensures the heat sink remains in firm contact with the electronic component.
* **Vibration Resistance:** The spring tension prevents the component from shifting during shipping or operation.
#### 4. Blue Anodized Coating
The blue anodization is not just aesthetic; it increases **surface emissivity**. In electronics, a coated surface radiates heat more effectively than bare polished aluminum, aiding in passive cooling when fans are at low speeds.
---
### ### Typical Applications
* **BGA Cooling:** Ball Grid Array processors.
* **Power Supplies:** Cooling MOSFETs or voltage regulators.
* **Telecommunications:** High-speed networking switches and routers.
- ⤷
What is the specific hole-to-hole spacing required for this heat sink?
- ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied TIM?
- ⤷ How does the thermal resistance change at higher airflow rates (e.g.
- ⤷ 600 LFM)?